Soft – Stamp Lithography

Process Order:
Mask Preparation
High aspect ratio lithography on 4″ wafers by mask and SPR22 photoresist or KMPR
Print by PDMS: (needs several wafers,not that easy to be done)
Microscope examination on printed copy
Recycling the process (usually this process needs to be done more than once)

› Shipley 1813
› ۴ Inch Wafer (P/N)
› ۲ Inch Wafer
› Raw Mask